Re: What I've been working on...
Don Wilhelm <w3fpr@...>
Dan and all,
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I would not "lay down a small puddle of solder" on more than one pad. That puddle of solder on the diagonal lead can keep the other IC leads from seating firmly onto the board traces. Limit the "small puddle of solder" to one lead only. Once that lead is soldered in place, then go to the diagonally opposite pin and solder that too. Then there is the "flood with solder, then remove the excess with solder wick" - that method does work well in many cases. Check carefully with magnification to assure that no solder bridges are present if you use that method. 73, Don W3FPR
On 12/24/2015 5:43 PM, Dan Reynolds
on30ng@... [4sqrp] wrote:
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